Hong Kong, April 4 (CNS) -- The Hong Kong Productivity Council (HKPC) announced on April 29 that HKPC's R&D achievements have achieved another good result at the 29 Geneva International Exhibition of Inventions, with a total of 2023 innovative R&D achievements commended, including 28 highest honors "Jury Commendation Gold Award", 3 "Gold Award", 2 "Silver Award" and 7 "Bronze Award".

The International Exhibition of Inventions of Geneva is the world's largest exhibition of innovation. It is reported that the 2023 Geneva International Exhibition of Inventions was held in Switzerland from April 4 to 26, and the exhibition included nearly 30,40 inventions from about 1000 countries and regions, and the number of inventors, universities, institutions and companies participating in the exhibition reached a record high.

HKPC showcased a series of innovative R&D achievements to judges and visitors, including "Intelligent Fault Monitoring System" and "Virtual Production System in the Metaverse", which attracted widespread attention at the exhibition. At this year's International Exhibition of Inventions of Geneva, HKPC was commended for 28 innovative R&D achievements, including 3 highest honors, "Gold Medal of Jury Commendation", 2 "Gold Award", 7 "Silver Award" and 16 "Bronze Award".

HKPC said that 75% of these award-winning R&D projects have been implemented to help partners solve industry pain points to fully grasp the latest business opportunities, and comprehensively promote Hong Kong's development into an international I&T hub and smart city.

Mr Joseph Chan, Chairman of HKPC, said that HKPC's outstanding results at the Invention Fair fully demonstrated Hong Kong's strength and achievements in technological innovation and R&D, and affirmed HKPC's position in the international I&T community. Mr Chan said that HKPC will continue to work hard to align with the policy policy of the HKSAR Government and I&T development measures to promote the development of Hong Kong's new industrialisation, green technology and artificial intelligence industries, create an atmosphere for the development of I&T in the community, enable more R&D achievements to be put into practice, and accelerate the development of Hong Kong into an international I&T hub.

Mr Kenneth Butt, Managing Director of HKPC, said he was honoured to once again receive world-class awards and the recognition of an international panel of experts. In the future, HKPC will continue to enhance its R&D and innovation capabilities, promote government-industry-university-research innovation collaboration, promote R&D of key core technologies and enable more R&D achievements to be transformed, so as to actively promote the development process of I&T in Hong Kong and continue to tell the story of I&T in Hong Kong. (End)