Panasonic and Japan IBM Japan partner in semiconductor manufacturing October 15th 19:17
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Panasonic and IBM Japan have announced a partnership in the field of semiconductor manufacturing. It is said that the manufacturing process can be greatly shortened by using data.
Panasonic and Japan IBM held a press conference in Osaka on the 15th.
The system that cuts the disk-shaped silicon wafer that is the basis of the semiconductor manufactured by Panasonic will be linked to the manufacturing management system that IBM Japan is good at.
The device that cuts silicon wafers took several weeks because it was necessary to make fine adjustments by hand when creating a new product.
IBM Japan's system has excellent ability to analyze manufacturing data, and it is said that by collaborating, it can automatically handle new products and shorten the manufacturing process from one to two days. .
As demand for high-performance semiconductors increases, the two companies want to improve productivity through collaboration.
Panasonic's Senior Managing Director Yasuyuki Higuchi said, “It is a field with great potential, but it is difficult to nurture skilled engineers. We want to create a situation where we can move ahead in competition and imitate other companies by using analytical technology.” It was.